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Global

Demystifying Semiconductor Die Procurement
Webinar Recording

Bridging the Divide Between Semiconductor Die Manufacturers and the Processed Bare Die You Need!

Recorded June 20, 2023

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Maximizing Value & Performance in DC-DC Power Supply for Space Systems
Live Webinar

In this webinar, industry experts in Hi-Rel power electronics design, packaging, testing, and qualification of Hybrid and Space-Grade PCB DC-DC power supplies, will provide the latest options and best practices in realizing the optimal power supplies for today’s high-reliability applications.

May 2, 2024 @ 11AM ET

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Ruggedizing COTS Components for Hi-Rel Applications
Webinar Recording

Minimize cost and extend mission life by 3X or more, while utilizing the latest Commercial-Off-the-Shelf (COTS) components, chip designs, and technology available.

Recorded September 28, 2023

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$134.3M DoD Contract Expands Micross Advanced Interconnect OSAT Capabilities in the US
Press Release

Micross has been awarded up to $134.3 million by the DoD under the IBAS Cornerstone RESHAPE program to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging solutions.

November 27, 2023

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Hi-Rel Components - Portchester, UK

Micross Portchester is a leading provider of high reliability hybrid electronics engineered for the harshest environments. Micross Portchester specializes in miniaturization of power, high pin count FPGAs/processors, analog, digital and mixed signal ruggedized IC package solutions. 

Portchester, UK

Location

+44 (0) 1603 788 967

 

+44 (0) 1603 788 920

Products & Services

Multi-Chip Modules (MCMs)

Flip chip assembly, precision die placement, heterogeneous integration, PADS process

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Assembly Services

Comprehensive array of in-house assembly capabilities that spans both the United States and Europe

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Hermetic Packaging

Ceramic, metal can, two/four sided LCC, gull wing, QFP, PGA, formed-leaded flat pack

More info

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